第四届图像与信号处理和生物医学工程与信息学国际学术会议投稿截止日延长至6月3日

第四届图像与信号处理和生物医学工程与信息学国际学术会议(CISP-BMEI 2011)应多位作者要求,特将投稿截止日延长至6月3日。会议将于2011年10月15至17日在中国第一大城市上海召开。

本会议部分最好论文扩展后在SCI 收录的期刊Computers and Electrical Engineering(正刊)免费发表,收入会议论文集的论文全部EI核心、ISTP、IEEE Xplore同时检索(CISP-BMEI 2008至2010全部论文已经EI核心检索,部分最好论文扩展后已经在SCI 收录的期刊Multimedia Tools and Applications、Artificial Intelligence in Medicine、Journal of Medical Systems等正刊免费发表)。

CISP-BMEI是本领域权威会议,每届吸引超过3000投稿和多位国际知名专家到会。

请在会议网站http://cisp-bmei.dhu.edu.cn 在线投稿(只限英文稿件,请在会议网站下载论文模板)。注册、版面等信息也请浏览会议网站。

欢迎大家投稿!

会议组委会

CISP-BMEI@dhu.edu.cn

We cordially invite you to submit a paper to the upcoming 4th International Congress on Image and Signal Processing (CISP 2011) and the 4th International Conference on BioMedical Engineering and Informatics (BMEI 2011), to be jointly held from 15-17 October 2011, in Shanghai, China. Due to numerous requests, the submission deadline is extended to 3 June 2011.

Shanghai is the largest city in China, with famous historical and cultural heritage. Attractions include Yuyuan Garden ("Happy Garden" built in Ming Dynasty), Shanghai Museum with 120,000 pieces of rare relics, Shanghai World Financial Center, Jade Buddha Temple (Song Dynasty), oriental Pearl TV Tower, Zhujiajiao Water Town, and Expo 2010 site.

All papers in conference proceedings will be indexed by both EI Compendex and ISTP, as well as included in the IEEE Xplore (IEEE Conference Record Number for CISP'11: 18205; IEEE Conference Record Number for BMEI'11: 18206. CISP-BMEI 2008-2010 papers have already been indexed in EI Compendex). Substantially extended versions of best papers will be considered for publication in a CISP'11-BMEI'11 special issue of the Computers and Electrical Engineering journal (SCI-indexed).  

CISP-BMEI is a premier international forum for scientists and researchers to present the state of the art of multimedia, signal processing, biomedical engineering and informatics. The previous CISP-BMEI each attracted over 3000 submissions from all over the world, with acceptance rate around 50%. The registration fee of US$400 includes proceedings, lunches, dinners, banquet, coffee breaks, and all technical sessions. CISP'11-BMEI'11 is technically co-sponsored by the IEEE Engineering in Medicine and Biology Society.

For more information, visit the conference web page:

   http://cisp-bmei.dhu.edu.cn


If you have any questions after visiting the conference web page, please email the secretariat at CISP-BMEI@dhu.edu.cn

Join us at this major event in exciting Shanghai !!!

organizing Committee

CISP-BMEI@dhu.edu.cn




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